- Ultra-small Pixel Pitch (P1.56mm): Achieves extremely high clarity and delicate image performance, maintaining smooth images and details even at close viewing distances. This is crucial for displaying complex charts, text, and video content in conference rooms.
- COB Packaging Technology:
- High Reliability: COB packaging integrates LED chips directly onto the PCB board, effectively protecting the chips from impact and static electricity damage, thereby improving the display’s stability and durability. This is particularly important in frequently used conference environments.
- Better Protection: Compared to traditional SMD packaging, the COB display surface is flatter and offers stronger dustproof, moisture-proof, and anti-collision capabilities, making it easy to clean and maintain.
- Excellent Heat Dissipation: The COB packaging structure facilitates the dissipation of heat from the chips, helping to lower the display’s operating temperature and thus extending its lifespan.
- Seamless Splicing: LED displays can achieve seamless splicing between unit modules, creating large screens of any size and aspect ratio, providing ample visual space for conference presentations.
- High Contrast and Color Performance: LED displays typically boast excellent contrast, capable of presenting deeper blacks and more vibrant colors, enhancing visual impact and making conference content more vivid.
- Wide Viewing Angle: Ensures that all attendees in the conference room, regardless of their seating position, can clearly see the screen content without viewing angle limitations.
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